Hardware Specifications
asin number
B0D8T6D6L8
model number
14-fe1011QU
Series
OmniBook X
processor
Snapdragon X Plus X1P-42-100
CPU Core
8 Cores
CPU Threads
8
CPU Speed GHz
3.2 GHz Base, up to 3.4 GHz Boost
CPU Cache MB
30 MB Total Cache
CPU Brand
Qualcomm
CPU Series
Snapdragon X Plus
CPU Model
X1P-42-100
CPU generation
1st Gen Qualcomm Windows Silicon
ram
16 GB
ram type
LPDDR5x
ram speed
8448 MT/s
RAM Technology
LPDDR5x (Soldered)
RAM DDR Type
LPDDR5x
RAM Slot Count
0 (Integrated)
Max RAM Supported
16 GB
RAM Upgradeable
No
storage type
SSD
storage size
512 GB
SSD Slot Type
M.2 PCIe Gen4 NVMe SSD
Compatible SSD Type
PCIe Gen4 NVMe M.2
SSD Slot Count
1
Max Storage Supported Total GB
1024 GB
Storage Upgradeable
Yes (By replacing existing SSD)
graphics card
Qualcomm Adreno GPU
GPU DDR
Shared Memory
GPU Size GB
System Shared Memory
has dedicated gpu
false
CPU Integrated GPU Model
Qualcomm Adreno GPU
operating system
Windows 11 Home (ARM)
screen size
14 inch
resolution
2.2K (2240 x 1400)
refresh rate
60 Hz
panel type
IPS (Multitouch-enabled, Edge-to-edge glass)
aspect ratio
16:10
brightness
400 nits
colour gamut
100% sRGB
HDR support
No
Colour
Glacier Silver
Design
Ultra-portable Sandblasted Anodized finish
Material
High-strength Aluminum
Touchscreen
Yes
webcam
HP True Vision 5MP IR Camera
Camera MP
5 MP
Camera Features
Windows Hello Face Unlock, Temporal Noise Reduction, Privacy Shutter
ports
1 x USB4 Type-C 40Gbps (Power Delivery, DisplayPort 1.4a), 1 x USB Type-C 10Gbps (Power Delivery, DisplayPort 1.4a), 1 x USB Type-A 10Gbps (HP Sleep and Charge), 1 x Headphone/Mic Combo
connectivity
Qualcomm FastConnect 7800 Wi-Fi 7 (2x2), Bluetooth 5.4
sensor
Ambient Light Sensor, IR Thermal Sensor
Display Features
Corning Gorilla Glass NBT, Micro-edge, Low Blue Light, Low Power
Special Features
Copilot+ PC, 45 TOPS NPU, Dedicated Copilot Key, HP Fast Charge, Poly Studio Audio Tuning
Audio Features
Poly Studio, Dual Speakers, HP Audio Boost
Speaker
Dual Speakers
Keyboard
Full-size, Backlit, Soft Grey Keyboard
battery
3-cell, 59 Wh Li-ion polymer
battery life
Up to 26 Hours (Video Playback)
battery Power
59 Wh
charger wattage
65 W USB Type-C Adapter
cooling system type
Single Fan High-Efficiency Cooling
User Serviceable Components
SSD Only
Repairability Score
6.8/10
weight
1.34 kg
dimensions
31.29 x 22.35 x 1.44 cm
launch year
2024
country of manufacture
China/India
included accessories
HP Creator Sling Bag, MS Office Home & Student 2021, Power Adapter
Warranty
1 Year Onsite Warranty
official 2 website name
hp.com
official 2 website link
https://www.hp.com/in-en/shop/hp-omnibook-x-laptop-14-fe1011qu-b17s7pa.html?facetref=ab1bc6eea5e688be
image source link
https://www.flipkart.com/hp-omnibook-snapdragon-x-plus-16-gb-512-gb-ssd-windows-11-home-14-fe1011qu-thin-light-laptop/p/itm409810c4c4227
image source name
Flipkart
last edited at
2026-04-19 10:15:11
Official Store Deal
BUY FROM FLIPKART.COM
Description
## HP OmniBook X 14-fe1011QU: The Vanguard of ARM-Powered Executive Computing
The **HP OmniBook X 14-fe1011QU** represents a definitive breakthrough in the architecture of professional mobility. Forged as a premier **Copilot+ PC**, this instrument is engineered for the executive who demands an intersection of extreme endurance and intelligent responsiveness. It is not merely a portable computer; it is a sophisticated neural-workstation designed to master **resource-intensive computational tasks** while maintaining an almost silent, cool-to-the-touch profile.
### 🧠 The Intelligence Architecture: Snapdragon X Plus
At the heart of the OmniBook X resides the **Snapdragon X Plus X1P-42-100**, an ARM-based silicon marvel built on a leading-edge **4nm process**. This SoC (System on Chip) redefines the efficiency-to-power ratio for the modern era.
* **Neural Processing Supremacy:** Outfitted with the Qualcomm Hexagon NPU delivering a staggering **45 TOPS**, the system facilitates **ultra-responsive simulations** and real-time AI background processing without drawing power from the primary compute cores.
* **Oryon Core Dynamics:** Featuring 8 high-performance Oryon cores and a massive **30 MB Total Cache**, the architecture is optimized for instantaneous data retrieval and fluid multitasking across stratified professional applications.
* **Unified Silicon Efficiency:** The **16 GB of LPDDR5x-8448 MHz RAM** is tightly coupled with the processor to provide low-latency throughput, crucial for **complex media rendering** and massive spreadsheet calculations.
### 🎨 Visual Fidelity: The 2.2K Precision Interface
The visual department is anchored by a 14-inch **2.2K (2240 x 1400) IPS canvas**, meticulously engineered for prolonged **high-fidelity visual consumption** without ocular strain.
* **Chromatic Depth:** This panel achieves **100% sRGB coverage**, ensuring that brand assets and intricate data visualizations are rendered with professional-grade accuracy.
* **Touch-Enabled Sophistication:** Protected by edge-to-edge glass, the multitouch interface allows for intuitive navigation through dense schematics and executive dashboards.
* **Luminance & Comfort:** With a consistent **400 nits** of brightness and an anti-reflective coating, clarity is maintained even in high-ambient light environments, supported by **TÜV Rheinland** low blue light certification.
### ⚡ Infrastructure & Connectivity: The Universal Interface
Despite its ultra-slim profile, the OmniBook X is a hub of high-speed connectivity, ensuring that peripheral bottlenecks are a relic of the past.
* **USB4® Dominance:** A primary **40Gbps USB4 Type-C** port provides a universal conduit for rapid power delivery, external high-resolution arrays via DisplayPort 1.4a, and massive data transfers.
* **Legacy Integrity:** Unlike many modern ultra-portables, this machine retains a **10Gbps USB Type-A** port with HP Sleep and Charge, ensuring that high-speed legacy hardware remains accessible.
* **Storage Velocity:** The 512 GB PCIe® Gen4 NVMe™ SSD provides a lightning-fast foundation for the operating system and critical proprietary data.
### 🛡️ Material Science & Executive Ergonomics
The chassis is a testament to sustainable luxury and structural engineering, meticulously passing **MIL-STD-810H** testing for durability against shock, vibration, and temperature extremes.
* **Chassis Composition:** The body is sculpted from **recycled CNC-milled aluminum**, providing a rigid, torsion-resistant frame that weighs a mere **1.34 kg**.
* **Haptic Mastery:** The keyboard is designed with a refined 1.3mm travel distance and a precise actuation force, optimized for silent, rapid long-form composition.
* **Immersive Acoustic Landscapes:** Dual-array microphones and a speaker system tuned by **Poly Studio** ensure crystalline clarity for executive briefings, creating a professional-grade spatial audio environment.
* **Enterprise Privacy:** Equipped with a 5MP IR camera for secure biometrics via Windows Hello and a physical privacy shutter to safeguard your workspace.
### ❄️ Thermal Equilibrium & Unmatched Longevity
The ARM architecture allows for a radical rethink of thermal management and energy consumption.
* **Silent Cooling:** Utilizing high-density fan blade geometry and advanced thermal composites, the system manages heat with minimal RPMs, ensuring an undisturbed acoustic environment during deep-focus work.
* **Transcendental Endurance:** The 3-cell, **59 Wh battery** leverages the efficiency of the Snapdragon X Plus to deliver a staggering operational window of up to **26 hours**, effectively removing the requirement for a power adapter during a standard business day.
* **Rapid Recovery:** **HP Fast Charge** technology restores the battery from 0% to 50% in approximately 30 minutes.
### 🚀 Launch Milestone
**Official Release:** June 2024. This model represents HP's flagship entry into the next generation of AI-centric, ARM-powered Windows computing.
### 🧬 Lineage & Evolution
The **14-fe1011QU** serves as the inaugural generation of the **OmniBook X** lineage, succeeding the high-end Spectre and Envy portfolios as a unified professional brand. This engineering evolution marks a pivot from x86 architecture to **Qualcomm’s Oryon silicon**, resulting in a **double-digit increase in battery longevity** and a **4x improvement in AI-specific throughput** compared to its Intel-based predecessors. The transition allows for a thinner, lighter chassis without sacrificing the structural integrity of the CNC-milled aluminum heritage.