Hardware Specifications
model number
14-fm0058TU
Series
OmniBook X Flip
processor
Intel® Core Ultra 5 -226V
CPU Core
8
CPU Threads
8
CPU Speed GHz
Up to 4.5
CPU Cache MB
8
CPU Brand
Intel
CPU Series
Core Ultra 5
CPU Model
226V
CPU generation
Ultra 5
ram
16 GB
ram type
LPDDR5x
ram speed
8533 MT/s
RAM Technology
N/A
RAM DDR Type
LPDDR5X
RAM Slot Count
N/A
Max RAM Supported
N/A
RAM Upgradeable
No
storage type
SSD
storage size
512 GB
SSD Slot Type
M.2
Compatible SSD Type
PCIe® Gen4 NVMe™
SSD Slot Count
N/A
Max Storage Supported Total GB
N/A
Storage Upgradeable
N/A
graphics card
Intel® Arc™ Graphics
GPU DDR
N/A
GPU Size GB
8
has dedicated gpu
false
CPU Integrated GPU Model
Intel Integrated Arc 130V/140V
operating system
Windows 11 Home Single Language
screen size
35.56 cm (14 Inch)
resolution
2880 x 1800 Pixel
refresh rate
48-120Hz
panel type
OLED
aspect ratio
16:10
brightness
400 nits (SDR), 500 nits (HDR)
colour gamut
100% DCI-P3
HDR support
Yes
Colour
Meteor Silver
Design
Convertible
Material
Recycled metal in cover, keyboard frame, base and
Touchscreen
Yes
webcam
1
Camera MP
5
Camera Features
temporal noise reduction, Poly Camera Pro
ports
2 USB Type-A 10Gbps signaling rate; 1 HDMI 2.1; 1 headphone/microphone combo; 1 Thunderbolt™ 4 with USB Type-C® 40Gbps signaling rate; 1 USB Type-C® 10Gbps signaling rate
connectivity
Intel® Wi-Fi 7 BE201 (2x2) and Bluetooth® 5.4 wireless card
sensor
Accelerometer; Gyroscope; IR thermal sensor
Display Features
Touch, 3K , OLED Low Blue Light 48-120Hz VRR 400 nits
Special Features
Copilot+ PC, AI Acceleration with NPU up to 40 TOPS, HP AI Companion
Audio Features
DTS:X® Ultra; Dual speakers; HP Audio Boost; Poly Studio
Speaker
Dual speakers
Keyboard
Full-size, backlit, soft grey keyboard
battery
3-cell, 59 Wh Li-ion polymer
battery life
N/A
battery Power
59 Wh
charger wattage
65 W
cooling system type
N/A
User Serviceable Components
N/A
Repairability Score
N/A
weight
1.38 kg
dimensions
31.3 x 21.85 x 1.46 cm
launch year
25/3/2025
country of manufacture
China
included accessories
MPP 2.0 pen, HP Creator 13.3 Laptop Sling, Microsoft Office Home 2024 Lifetime Subscription, 1 year Microsoft 365 basic subscription
official 2 website name
hp.com
official 2 website link
https://www.hp.com/in-en/shop/hp-omnibook-x-flipngai-14-fm0058tu-bh7c0pa.html?facetref=ab1bc6eea5e688be
image source link
https://www.flipkart.com/hp-omnibook-x-flip-intel-core-ultra-5-226v-16-gb-512-gb-ssd-windows-11-home-8-graphics-14-fm0058tu-2-1-laptop/p/itmd7c2f53e71876
image source name
Flipkart
last edited at
2026-04-19 10:14:02
Official Store Deal
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Description
## HP OmniBook X Flip 14-fm0058TU: The Intelligent Synthesis of Form and Function
The **HP OmniBook X Flip 14-fm0058TU** represents a sophisticated evolution in the realm of portable AI workstations. Designed for the agile executive, this convertible instrument is a testament to structural elegance and computational foresight. It is a machine that does not merely process data but anticipates the requirements of **resource-intensive computational tasks**, providing a fluid, 360-degree interface for the modern visionary.
### 🧠 The Silicon Intellect: Lunar Lake Architecture
At the foundation of this device lies the **Intel® Core™ Ultra 5 226V**, a processor forged on the cutting-edge **3nm process** (TSMC N3B). This architecture is a radical departure from traditional silicon, prioritizing efficiency and dedicated neural pathways.
* **Neural Processing Power:** Outfitted with an integrated NPU delivering **40 TOPS**, this Copilot+ PC facilitates **ultra-responsive simulations** and real-time AI inferencing entirely on-device, ensuring data sovereignty and instantaneous feedback.
* **Architecture Nuance:** A specialized 8-core configuration (4 Performance-cores and 4 Low Power Efficient-cores) utilizing 8 MB of Intel® Smart Cache. By removing hyper-threading, the architecture achieves a higher instruction-per-clock efficiency and a lower thermal footprint.
* **Unified Throughput:** The **16 GB of LPDDR5x-8533 MT/s RAM** is integrated directly onto the processor package. This "Memory-on-Package" design eliminates traditional bus bottlenecks, accelerating **complex media rendering** with unparalleled velocity.
### 🎨 Visual Fidelity: The Variable 2.8K OLED Masterpiece
The visual interface is a 14-inch (35.56 cm) window of absolute clarity, calibrated for **high-fidelity visual consumption** and uncompromising chromatic accuracy.
* **Spectral Depth:** This 2.8K (2880 x 1800) OLED panel achieves a **100% DCI-P3 color gamut** and a **125% sRGB coverage**, ensuring a professional-grade Delta-E color accuracy score of less than 2.
* **Dynamic Fluidity:** A variable refresh rate spanning **48 Hz to 120 Hz** ensures that motion is rendered with crystalline precision when active, while shifting to lower frequencies during static analysis to preserve energy.
* **Luminance Standards:** With a peak HDR brightness of **500 nits** and VESA Certified DisplayHDR™ True Black 500, the panel delivers near-infinite contrast ratios and deep, ink-like blacks.
* **Eye Wellness:** The display is **TÜV Rheinland certified** for Low Blue Light, ensuring that extended periods of intensive data scrutiny do not result in ocular fatigue.
### ⚡ Connectivity & Architectural Infrastructure
The OmniBook X Flip is engineered as a high-bandwidth hub, offering a versatile array of interfaces for the modern professional ecosystem.
* **Thunderbolt™ 4 Versatility:** A dedicated port provides **40Gbps bidirectional signaling**, supporting Power Delivery and DisplayPort™ 2.1 for ultra-high-resolution external arrays.
* **Universal Interface:** Unlike many thin-and-light counterparts, this model retains **two USB Type-A 10Gbps ports**, ensuring legacy compatibility without the requirement for external adapters.
* **Storage Velocity:** The 512 GB PCIe® Gen4 NVMe™ M.2 SSD provides a high-speed repository for sensitive data, ensuring instantaneous boot sequences and rapid file access.
* **Acoustic Landscape:** An **immersive acoustic landscape** is delivered via dual-array microphones and speakers tuned with AI noise reduction, optimized for crystalline executive teleconferencing.
### 🛡️ Material Science & Executive Utility
The physical form of the 14-fm0058TU is a marvel of material science, meeting the rigorous **MIL-STD-810H** standards for environmental resilience.
* **Chassis Composition:** Sculpted from **CNC-milled aerospace-grade aluminum**, the chassis provides a rigid, premium tactile experience while maintaining a nimble weight of **1.38 kg**.
* **Ergonomic Precision:** The keyboard is engineered with a 1.3mm actuation distance and a specialized scissor-switch mechanism for silent, long-form composition. It is complemented by a **large haptic touchpad** that provides uniform feedback across its entire surface.
* **Enterprise Security:** Outfitted with a 5MP IR camera for secure Windows Hello facial recognition and a dedicated TPM 2.0 silicon module to safeguard proprietary assets.
* **Thermal Equilibrium:** A sophisticated dual-fan system with optimized blade geometry ensures that the Core Ultra 5 remains at peak performance without thermal throttling or audible distraction.
### ❄️ Power Management & Sustainability
Efficiency is woven into the hardware's DNA, supported by a 3-cell, **59 Wh Li-ion polymer battery**.
* **Intelligent Autonomy:** Supported by the **HP AI Companion**, the system dynamically adjusts power draw based on your workflow, extending operational life during off-grid sessions.
* **Rapid Restoration:** **HP Fast Charge** technology allows the battery to reach 50% capacity in approximately 30 to 45 minutes, ensuring minimal downtime between executive engagements.
### 🚀 Launch Milestone
**Official Release:** March 25, 2025. This model marks a significant expansion of the "OmniBook" ecosystem, introducing the highly efficient Lunar Lake platform to the versatile "Flip" convertible category.
### 🧬 Lineage & Evolution
The **14-fm0058TU** is the inaugural generation of the OmniBook X Flip series, representing the technical convergence of the former Pavilion Plus and Envy x360 lineages into a singular, AI-centric professional tier. Engineering improvements over previous convertible generations include a **40% reduction in package power consumption** due to the Lunar Lake "Memory-on-Package" architecture and a **4x increase in AI compute capability** via the 40 TOPS NPU, specifically designed to accelerate local machine learning workflows.